[PDF.31wk] More-than-Moore 2.5D and 3D SiP Integration

More-than-Moore 2.5D and 3D SiP Integration

[PDF.na86] More-than-Moore 2.5D and 3D SiP Integration

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 | #1994683 in Books |  2017-03-09 | Original language:English | PDF # 1 |  9.21 x.50 x6.14l, | File type: PDF | 182 pages

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||From the Back Cover|This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manuf...

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